This e-book introduces microelectromechanical structures (MEMS) packaging using polymers or skinny motion pictures – a brand new and special packaging know-how. It first investigates the connection among utilized load and beginning displacement as a functionality of benzocyclobutene (BCB) cap dimension to discover the debonding habit, after which offers BCB cap deformation and rigidity improvement at varied establishing displacements as a functionality of BCB thickness, that is a criterion for BCB cap move failure.
Transfer packaging suggestions are attracting expanding curiosity simply because they bring packaging caps, from provider wafers to machine wafers, and reduce the fabrication concerns often encountered in thin-film or polymer cap encapsulation. The e-book describes very-low-loss polymer cap or thin-film-transfer concepts in response to anti-adhesion coating equipment for radio frequency (RF) (-MEMS) machine packaging. because the polymer caps are vulnerable to deformation as a result of their particularly low mechanical stiffness in the course of debonding of the service wafer, the e-book develops a suitable finite point version (FEM) to simulate the debonding approach taking place within the interface among Si provider wafer and BCB cap. finally, it comprises the load–displacement curve of alternative fabrics and provides a versatile polymer filter out and a tunable clear out as examples of the purposes of the proposed technology.
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Extra resources for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface ... (Springer Series in Advanced Manufacturing)
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface ... (Springer Series in Advanced Manufacturing)